YOUR SHOPPING CART IS EMPTY
Featured
Feature:
- Intelligent preheating
- Positing iPhone mainboard with free fixing buckle
- Removing chips on iPhone mainboard
- Removing glue on iPhone mainboard
- Remove shielding cover: 180℃-200℃
- Romove CPU edge glue: 180℃-200℃
- Remove A8/A9/A10 CPU: 230℃-240℃
- Remove glue: 180℃-200℃
- Reballing chips: 180℃-200℃
Package include:
1 x MECHANIC C9 Welding Heating Platform (Soldering Iron not include)