Multi-Function BGA Reballing Positioning Fixture Motherboard Cooling Soldering Desoldering Platform For IPhone X

Feature:

• Uses heat conduction of pure copper for avoiding tin-burst on the back IC of cell phone motherboard, apply heat conduction sticker on the back of the IC on motherboard to prevent metal directly touching IC and cause IC damage, pure copper heat conduction block does not directly contact the main board
• Added CPU positioning structure. No manual positioning needed, improve the success rate.
• Non-slip foot pad. Use stability.
• With integrated layer tin planting function. The precision stencils are produced by world's leading laser technology.
• Added motherboard layer separation and positioning installation structure.
• Designed with precision positioning column, it will makes efficient repairs for separating, soldering and installation.
• Pure copper heat conduction material are dealt with special process so that surface color will keep new.
• Apply imported synthetic stone materials, a number of testing and improved precision processing with 500 degree high temperature direct heating, durable and no deformation

Package include:
1 x Working Platform
1 x NAND BGA Reballing Net