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WL 0.12MM PCB Positioning Mold Steel Plate BGA Reballing Stencil For IPhone X

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IP-938103

WL 0.12MM PCB Positioning Mold Steel Plate BGA Reballing Stencil For IPhone X

SUMMARY

WL 0.12MM PCB Positioning Mold Steel Plate BGA Reballing Stencil For IPhone X

  • Buy 3 for USD 4.76 each and save 3%
  • Buy 5 for USD 4.66 each and save 5%
  • Buy 10 for USD 4.51 each and save 8%

Availability: In stock

USD 4.90

180 days days warrenty

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